Thanks Doug,

This article is of January 2000, is it still relevant?

Is the PCB finish is the same, and the process is HASL?


Best  Regards

 Reuven




                      "Romm, Doug"
                      <[log in to unmask]>            To:      [log in to unmask]
                      Sent by:                 cc:
                      Leadfree                 Subject: Re: [LF] Sn-3Ag-0.5Cu
                      <[log in to unmask]
                      G>


                      26/08/2003 16:36
                      Please respond
                      to "(Leadfree
                      Electronics
                      Assembly
                      Forum)"; Please
                      respond to
                      "Romm, Doug"





Reuven,


My observations are:


Users in Japan are making plans to use the SnAgCu alloy that you mention
with 3% Ag.


However, this differs from the NEMI recommended alloy of Sn3.9Ag0.6Cu.  The
NEMI recommendation can be seen in this press release:
http://www.nemi.org/newsroom/PR/2000/PR012400.html.  Most Japanese users
appear to be focused on SnAgCu alloys with 3.5-4.0% Ag, rather than the 3%
Ag.


I don't have a comment on performance differences between the SnAgCu alloys
with 3% Ag versus 3.5-4.0% Ag, but I'm certain others will have inputs.







Best regards,


Doug Romm
Texas Instruments








-----Original Message-----
From: Reuven ROKAH [mailto:[log in to unmask]]
Sent: Tuesday, August 26, 2003 8:27 AM
To: [log in to unmask]
Subject: [LF] Sn-3Ag-0.5Cu





Hello LF Forum


As I understood from JEITA Roadmap, the above alloy is the most recommended

one.


Can anyone inform his experience with PCBs finished with Sn-3Ag-0.5Cu and
the how the finish process is done (by hot leveled air?).





Best  Regards


 Reuven


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