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Subject:	Re: PCB finishing type for lead free solution with CSP, BGA & press-fit connector
From:	Paul Watson <[log in to unmask]>
Reply To:	(Leadfree Electronics Assembly Forum)
Date:	Thu, 21 Aug 2003 17:01:50 +0100
Content-Type:	text/plain
Parts/Attachments:	text/plain (51 lines)

I am sure Bob will comment but just to let everyone know that all testing
carried out to date by Cemco has been with SnCu and SnCuNi. OEM companies
with whom we have worked have not requested other alloys as part of their
test programs. While application is of primary concern when deciding on
board finish,  cost is still important and SnCu is probably going to be the
least expensive. Is anyone interested in having samples processed using
SnAgCu. Is it really necessary?

Paul Watson


-----Original Message-----
From: MA/NY DDave [mailto:[log in to unmask]]
Sent: Thursday, August 21, 2003 2:34 AM
To: [log in to unmask]
Subject: Re: [LF] PCB finishing type for lead free solution with CSP,
BGA & press-fit connector


Hi Tyco-Bob, and IPC-LF Listserve,

Thanks it looks like a nice report from your European colleages.

Has an experiment with SnAgCu as the alloy for HAL (or HASL)
been discussed?

YiEngr, MA/NY DDave

P.S. Are you out of the Boston area?

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