Hi Bob, and IPC-LF Listservers,

Note: Bob sent a note to me and to this list responding to my
previous note, yet for some reason it doesn't appear. I have
pasted below only a bit of Bob's message that I wanted to furthur
discuss and added one other question under this subject tread.

<--- BobW's note snipped --->
<Well I think I can comment.
<
<The NPL report which is available from the NPL web site on Lead Free
<Reliability with Mixed Alloy Rework concludes that there were few
<issues. I have said the team should, in my opinion, have included
<reliability testing of rework joints as another reference.
<I currently work with the NPL team, but Chris Hunt may like to
<discuss the issue further on the forum.
<----------------------


When I first read that you were allowing mixing of alloys I thought
of all the LF alloys I have seen discussed. Now I am guessing that
you probably meant a range within the SnAgCu family, yet I could
be wrong. Please comment or maybe Chris can??

Would you mix all the way from SnAg25Cu07 to SnAg47Cu17
and also SnAg25Cu07Sb05 into the mix??

It seems a bit messy to me and tough for a Reliability person.

Next Question:
When you did your LeadFree HAL (Hot Air Leveling) or HASL
which alloy did you use?  Did you also HASL with different
alloys to experiment with that processing/material facet??

YiEngr, MA/NY DDave


On Mon, 11 Aug 2003 15:49:08 +0100, Bob Willis <[log in to unmask]> wrote:

>Following the comment from Peter we used solder levelled boards on the
>Lead Free Experience I was running six weeks back in Brighton the
>process, equipment, finishes and components we were running at outlined
> in the story. http://www.smartgroup.org/ev_leadfree3.asp

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