Subject: | |
From: | |
Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Wed, 13 Aug 2003 19:17:09 -0500 |
Content-Type: | text/plain |
Parts/Attachments: |
|
|
Hi Jean, WernerE, and IPC-LF Listservers,
Jean, since you have had a bit more time reviewing the reported
data do you see anything wrong/amiss/off.
I am a bit doubtful that we could see SnPb being higher in creep
rate at lower stresses and then SAC all of a sudden becoming
higher. My only thought is that the researchers made some mistake
like comparing pre-yield point SnAgCu to post-yield point SnPb
and a pile more quite easy mistakes like improper lead metalurgy,
or holes in the joint.
All the photos, cross sections, and data that I have seen indicate
that SnAgCu (SAC) is a higher strength material.
YiEngr, MA/NY DDave
-------------------------------------------------------------------------------Leadfee Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-------------------------------------------------------------------------------
|
|
|