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August 2003

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Subject:
From:
MA/NY DDave <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 13 Aug 2003 19:17:09 -0500
Content-Type:
text/plain
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text/plain (26 lines)
Hi Jean, WernerE, and IPC-LF Listservers,

Jean, since you have had a bit more time reviewing the reported
data do you see anything wrong/amiss/off.

I am a bit doubtful that we could see SnPb being higher in creep
rate at lower stresses and then SAC all of a sudden becoming
higher. My only thought is that the researchers made some mistake
like comparing pre-yield point SnAgCu to post-yield point SnPb
and a pile more quite easy mistakes like improper lead metalurgy,
or holes in the joint.

All the photos, cross sections, and data that I have seen indicate
that SnAgCu (SAC) is a higher strength material.

YiEngr, MA/NY DDave

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