Jean Paul / Werner
We work on that.
- Thesis on degradation mechanisms of SnAgCu
- Slow thermal cycles wit assembled PCB's
- Looking for a student at ETHZ writing a diploma work in modelling the deformation behaviour of SnAgCu similar to the work we did for SnPbAg.
But as Jean Paul said it needs some time.
Werner: I didn't forget you. Getting the pictures together.
Best regards
Guenter
EMPA
Swiss Federal Laboratories for Materials Testing and Research
Centre for Reliability
Guenter Grossmann, Senior Engineer
8600 Duebendorf
Switzerland
Phone: xx41 1 823 4279
Fax : xx41 1 823 4054
mail: [log in to unmask]
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