Subject: | |
From: | |
Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Mon, 11 Aug 2003 14:43:37 -0400 |
Content-Type: | text/plain |
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Lee:
PCB materials can impact the insertion/extraction performance of press-fit
interconnects. There is a paper on our website at:
http://www.tycoelectronics.com/environment/leadfree/pdf/leadfree_press-in_cu
stomer_report.pdf
We will also be presenting some updates at IEEE/HOLM and IPC meetings this
fall.
Cheers,
Bob Hilty
Tyco Electronics
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: Monday, August 11, 2003 3:56 AM
To: [log in to unmask]
Subject: [LF] PCB finishing type for lead free solution with CSP, BGA &
press-fit connector
Hello,
We have a new project with a very complicated assembly model.
Both side SMT (BGA, CSP, CCGA & QFP .....) , THT ( a lot od dip
component ) and some press-fit connectors.
Who can provide any recommendations for the PCB finishing type ?
Selective imm. Au with OSP ?
Or immersion silver ? Immersion Tin ?
Why ? And why not ?
Irving
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