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Subject:	Re: Accelerated Thermal Cycle Profile
From:	Werner Engelmaier <[log in to unmask]>
Reply To:	(Leadfree Electronics Assembly Forum)
Date:	Mon, 4 Aug 2003 13:20:54 EDT
Content-Type:	text/plain
Parts/Attachments:	text/plain (22 lines)

Hi Dave,
With Sn/Pb solders we have solder fatigue models that account for the
incomplete creep in accelerated testing, as long some controlled and not
insignificant amount of creep in fact has taken place during the accelerated cycling [see
IPC-SM-785].
The rapid [T-shock/no dwells] cycling will not only operate in the elastic
regime but there will also be plastic deformation by yielding--however, there
will essentially no plastic deformation due to creep which is the important
damage mechanism.

Regards,
Werner Engelmaier

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