Kirk..
I've been looking into this, Labor day weekend is tough w/ frequent flyer
tickets... there are a lot of blackout dates w/ff tickets, and this is one
of them.
My travel agent is workign on it though.
will keep you posted.
-Jim
----- Original Message -----
From: "Automatic digest processor" <[log in to unmask]>
To: "Recipients of Leadfree digests" <[log in to unmask]>
Sent: Monday, August 11, 2003 10:24 AM
Subject: Leadfree Digest - 9 Aug 2003 to 11 Aug 2003 - Special issue
(#2003-115)
> There are 7 messages totalling 1025 lines in this issue.
>
> Topics in this special issue:
>
> 1. Component Maximum Reflow Temperature Requirement (6)
> 2. PCB finishing type for lead free solution with CSP, BGA & press-fit
> connector
>
> --------------------------------------------------------------------------
-----Leadfee Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Leadfree
> To temporarily stop delivery of Leadree for vacation breaks send: SET
Leadfree NOMAIL
> Search previous postings at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
> --------------------------------------------------------------------------
-----
>
> ----------------------------------------------------------------------
>
> Date: Mon, 11 Aug 2003 06:56:51 +0100
> From: Bob Willis <[log in to unmask]>
> Subject: Re: Component Maximum Reflow Temperature Requirement
>
> A number of people have commented on the active component issues with
> lead-free but the original mail did relate to plastics for other
mechanical
> parts. Don't forget all these parts and others lime:
>
> IDC cables
> Wire insulation
> Coating and potting on components
> Transformer and Inductor coating and impregnations materials
> Loose cable insulation
> LCD displays
> Labels
>
> Bob Willis
> 2 Fourth Ave, Chelmsford, Essex, CM1 4HA
> Tel: 01245 351502
> Fax: 01245 496123
> Mobile: 07860 775858
> Email: [log in to unmask]
> Web: www.leadfreesoldering.com
> Web: www.bobwillis.co.uk
>
>
> -----Original Message-----
> From: Leadfree [mailto:[log in to unmask]]On Behalf Of MA/NY
> DDave
> Sent: 09 August 2003 19:00
> To: [log in to unmask]
> Subject: Re: [LF] Component Maximum Reflow Temperature Requirement
>
>
> Hi
>
> CA-JoeF (of Flex Circuit/Tesera fame) certainly did well with this
> addition to this note tread.
>
> Beyond Joe's great note, I hope I was exploring your own Product
> Reliability and Field Needs and your Leadership leading manufacturers
> and component suppliers meeting your needs; as well as, their process
> which is secondary to your product needs.
>
> I like Joe's note.
>
> YiEngr, MA/NY DDave
>
> >You may wish to add to your question:
> >
> >"To what JEDEC Moisture Sensitivity Level (MSL) will the components be
> >certified and to what thermal cycling conditions will the supplier
> >guarantee the components to perform with what lead-free solder alloy(s)?
"
> >
> >These answers will highlight the needs for component prep and assembly
> >process and rework but they will also help (hopefully) to provide
> >engineering with expectations for reliability, management and accounting
> >with a sense of the increase cost associated with the new lead-free
> >products and a greater sense of liability for the potential cost of
> >returns and loss of customer goodwill due to field failures when they
> >eventually occur.
> >
> >This unfortunately does not solve all of the potential for mix-ups but
> >it is a start.
> >
> >The more information we have the better the decisions we should be able
> > to make.
> >
> >Kind regards,
> >Joe
>
> --------------------------------------------------------------------------
--
> ---Leadfee Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Leadfree
> To temporarily stop delivery of Leadree for vacation breaks send: SET
> Leadfree NOMAIL
> Search previous postings at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> --------------------------------------------------------------------------
--
> ---
>
> --------------------------------------------------------------------------
-----Leadfee Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Leadfree
> To temporarily stop delivery of Leadree for vacation breaks send: SET
Leadfree NOMAIL
> Search previous postings at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
> --------------------------------------------------------------------------
-----
>
> ------------------------------
>
> Date: Mon, 11 Aug 2003 09:36:31 +0300
> From: Reuven ROKAH <[log in to unmask]>
> Subject: Re: Component Maximum Reflow Temperature Requirement
>
> Hi All,
>
> When designing a new PWB or making it to be LF comply, what requirements
> are needed for each component or PCB, such as:
>
> 1. PCB Tg. = 170 deg. C
> 2. Components to be comply with reflow temp. of 250 deg. C
>
> There is any agreed list of requirements?
>
> Best Regards
>
> ROKAH Reuven
>
> --------------------------------------------------------------------------
-----Leadfee Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Leadfree
> To temporarily stop delivery of Leadree for vacation breaks send: SET
Leadfree NOMAIL
> Search previous postings at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
> --------------------------------------------------------------------------
-----
>
> ------------------------------
>
> Date: Mon, 11 Aug 2003 07:35:19 +0100
> From: Bob Willis <[log in to unmask]>
> Subject: Re: Component Maximum Reflow Temperature Requirement
>
> There are benefits to the higher Tg but most companies using lead-free do
> not use it yet as the standard Tg for laminates has increase over the
years
> anyway. I have been running some trials specifically on standard and
> material with a Tg of 170 but no interesting results from a process
> prospective yet.
>
> In the case of maximum temperature the problem is the variability that the
> industry will see in reflow and rework hence the suggested need of 260C.
> This gives process guys like me more tolerance in the process. Currently
the
> processes I have been working with can reflow at maximum of 245 for
> convection, 230 for VP and 265 for wave. Remember many passives and active
> parts go through the wave in the real world.
>
> Rework can be controlled below 250 with the correct preheat. The key issue
> is more attention to profiling boards, since the introduction of
convection
> many engineers don't spend the time on profiling?
>
> Bob Willis
> 2 Fourth Ave, Chelmsford, Essex, CM1 4HA
> Tel: 01245 351502
> Fax: 01245 496123
> Mobile: 07860 775858
> Email: [log in to unmask]
> Web: www.leadfreesoldering.com
> Web: www.bobwillis.co.uk
>
>
>
> -----Original Message-----
> From: Leadfree [mailto:[log in to unmask]]On Behalf Of Reuven
> ROKAH
> Sent: 11 August 2003 07:37
> To: [log in to unmask]
> Subject: Re: [LF] Component Maximum Reflow Temperature Requirement
>
>
> Hi All,
>
> When designing a new PWB or making it to be LF comply, what requirements
> are needed for each component or PCB, such as:
>
> 1. PCB Tg. = 170 deg. C
> 2. Components to be comply with reflow temp. of 250 deg. C
>
> There is any agreed list of requirements?
>
> Best Regards
>
> ROKAH Reuven
>
> --------------------------------------------------------------------------
--
> ---Leadfee Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Leadfree
> To temporarily stop delivery of Leadree for vacation breaks send: SET
> Leadfree NOMAIL
> Search previous postings at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> --------------------------------------------------------------------------
--
> ---
>
> --------------------------------------------------------------------------
-----Leadfee Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Leadfree
> To temporarily stop delivery of Leadree for vacation breaks send: SET
Leadfree NOMAIL
> Search previous postings at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
> --------------------------------------------------------------------------
-----
>
> ------------------------------
>
> Date: Mon, 11 Aug 2003 09:59:48 +0300
> From: Reuven ROKAH <[log in to unmask]>
> Subject: Re: Component Maximum Reflow Temperature Requirement
>
> Thanks Bob.
>
>
> Best Regards
>
> ROKAH Reuven
>
>
>
>
> Bob Willis
> <[log in to unmask] To:
[log in to unmask]
> O.UK> cc:
> Sent by: Subject: Re: [LF] Component
Maximum Reflow Temperature Requirement
> Leadfree
> <Leadfree@LISTSE
> RV.IPC.ORG>
>
>
> 11/08/2003 09:35
> Please respond
> to "(Leadfree
> Electronics
> Assembly
> Forum)"; Please
> respond to Bob
> Willis
>
>
>
>
>
> There are benefits to the higher Tg but most companies using lead-free do
> not use it yet as the standard Tg for laminates has increase over the
years
> anyway. I have been running some trials specifically on standard and
> material with a Tg of 170 but no interesting results from a process
> prospective yet.
>
> In the case of maximum temperature the problem is the variability that the
> industry will see in reflow and rework hence the suggested need of 260C.
> This gives process guys like me more tolerance in the process. Currently
> the
> processes I have been working with can reflow at maximum of 245 for
> convection, 230 for VP and 265 for wave. Remember many passives and active
> parts go through the wave in the real world.
>
> Rework can be controlled below 250 with the correct preheat. The key issue
> is more attention to profiling boards, since the introduction of
convection
> many engineers don't spend the time on profiling?
>
> Bob Willis
> 2 Fourth Ave, Chelmsford, Essex, CM1 4HA
> Tel: 01245 351502
> Fax: 01245 496123
> Mobile: 07860 775858
> Email: [log in to unmask]
> Web: www.leadfreesoldering.com
> Web: www.bobwillis.co.uk
>
>
>
> -----Original Message-----
> From: Leadfree [mailto:[log in to unmask]]On Behalf Of Reuven
> ROKAH
> Sent: 11 August 2003 07:37
> To: [log in to unmask]
> Subject: Re: [LF] Component Maximum Reflow Temperature Requirement
>
>
> Hi All,
>
> When designing a new PWB or making it to be LF comply, what requirements
> are needed for each component or PCB, such as:
>
> 1. PCB Tg. = 170 deg. C
> 2. Components to be comply with reflow temp. of 250 deg. C
>
> There is any agreed list of requirements?
>
> Best Regards
>
> ROKAH Reuven
>
> --------------------------------------------------------------------------
--
>
> ---Leadfee Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Leadfree
> To temporarily stop delivery of Leadree for vacation breaks send: SET
> Leadfree NOMAIL
> Search previous postings at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> --------------------------------------------------------------------------
--
>
> ---
>
> --------------------------------------------------------------------------
-----Leadfee
>
> Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Leadfree
> To temporarily stop delivery of Leadree for vacation breaks send: SET
> Leadfree NOMAIL
> Search previous postings at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> --------------------------------------------------------------------------
-----
>
> --------------------------------------------------------------------------
-----Leadfee Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Leadfree
> To temporarily stop delivery of Leadree for vacation breaks send: SET
Leadfree NOMAIL
> Search previous postings at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
> --------------------------------------------------------------------------
-----
>
> ------------------------------
>
> Date: Mon, 11 Aug 2003 15:56:25 +0800
> From: =?big5?B?IkxlZSwgSXJ2aW5nICin9an6qfQgVEFPKSI=?=
> <[log in to unmask]>
> Subject: PCB finishing type for lead free solution with CSP, BGA &
press-fit connector
>
> Hello,
>
> We have a new project with a very complicated assembly model.
>
> Both side SMT (BGA, CSP, CCGA & QFP .....) , THT ( a lot od dip =
> component ) and some press-fit connectors.
>
> Who can provide any recommendations for the PCB finishing type ?
>
> Selective imm. Au with OSP ?
> Or immersion silver ? Immersion Tin ?
>
> Why ? And why not ?
>
>
> Irving
> =20
>
> --------------------------------------------------------------------------
-----Leadfee Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Leadfree
> To temporarily stop delivery of Leadree for vacation breaks send: SET
Leadfree NOMAIL
> Search previous postings at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
> --------------------------------------------------------------------------
-----
>
> ------------------------------
>
> Date: Mon, 11 Aug 2003 10:36:09 -0400
> From: Carol Handwerker <[log in to unmask]>
> Subject: Re: Component Maximum Reflow Temperature Requirement
>
> --=====================_-1870403248==_.ALT
> Content-Type: text/plain; charset="us-ascii"
>
> Thought you might find this to be useful: There was an interesting paper
on
> laminate performance titled "Effects of NEMI Sn/Ag/Cu Alloy Assembly
REflow on
> Plated Through Hole Performance" by John J. Davignon and Randy Reed (SMTA,
June
> 2000, pp. 122-129.) The paper evaluated the "changes in PTH performance
and
> laminate material properties for several epoxy-based laminate systems" for
a
> peak reflow temperature of 260 degC, and up to 5 reflow cycles.
>
> A summary of the paper can be found at:
> http://www.eetasia.com/ARTICLES/2000OCT/2000OCT01_THA_PM_TA1.PDF
>
> Regards,
> Carol Handwerker
> NIST
>
> At 07:35 AM 08/11/2003 +0100, Bob Willis wrote:
> >There are benefits to the higher Tg but most companies using lead-free do
> >not use it yet as the standard Tg for laminates has increase over the
years
> >anyway. I have been running some trials specifically on standard and
> >material with a Tg of 170 but no interesting results from a process
> >prospective yet.
> >
> >In the case of maximum temperature the problem is the variability that
the
> >industry will see in reflow and rework hence the suggested need of 260C.
> >This gives process guys like me more tolerance in the process. Currently
the
> >processes I have been working with can reflow at maximum of 245 for
> >convection, 230 for VP and 265 for wave. Remember many passives and
active
> >parts go through the wave in the real world.
> >
> >Rework can be controlled below 250 with the correct preheat. The key
issue
> >is more attention to profiling boards, since the introduction of
convection
> >many engineers don't spend the time on profiling?
> >
> >Bob Willis
> >2 Fourth Ave, Chelmsford, Essex, CM1 4HA
> >Tel: 01245 351502
> >Fax: 01245 496123
> >Mobile: 07860 775858
> >Email: [log in to unmask]
> >Web: www.leadfreesoldering.com
> >Web: www.bobwillis.co.uk
> >
> >
> >
> >-----Original Message-----
> >From: Leadfree [mailto:[log in to unmask]]On Behalf Of Reuven
> >ROKAH
> >Sent: 11 August 2003 07:37
> >To: [log in to unmask]
> >Subject: Re: [LF] Component Maximum Reflow Temperature Requirement
> >
> >
> >Hi All,
> >
> >When designing a new PWB or making it to be LF comply, what requirements
> >are needed for each component or PCB, such as:
> >
> >1. PCB Tg. = 170 deg. C
> >2. Components to be comply with reflow temp. of 250 deg. C
> >
> >There is any agreed list of requirements?
> >
> >Best Regards
> >
> >ROKAH Reuven
> >
>
>---------------------------------------------------------------------------
-
> >---Leadfee Mail List provided as a free service by IPC using LISTSERV
1.8d
> >To unsubscribe, send a message to [log in to unmask] with following text in
> >the BODY (NOT the subject field): SIGNOFF Leadfree
> >To temporarily stop delivery of Leadree for vacation breaks send: SET
> >Leadfree NOMAIL
> >Search previous postings at: http://listserv.ipc.org/archives
> >Please visit IPC web site http://www.ipc.org/html/forum.htm for
additional
> >information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> >ext.5315
>
>---------------------------------------------------------------------------
-
> >---
> >
>
>---------------------------------------------------------------------------
-
> >---Leadfee Mail List provided as a free service by IPC using LISTSERV
1.8d
> >To unsubscribe, send a message to [log in to unmask] with following text in
> >the BODY (NOT the subject field): SIGNOFF Leadfree
> >To temporarily stop delivery of Leadree for vacation breaks send: SET
> >Leadfree NOMAIL
> >Search previous postings at: http://listserv.ipc.org/archives
> >Please visit IPC web site http://www.ipc.org/html/forum.htm for
additional
> >information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> >ext.5315
>
>---------------------------------------------------------------------------
> ----
>
> **************************************
> Carol A. Handwerker
> Chief, Metallurgy Division
> NIST
> 100 Bureau Drive Stop 8550
> Gaithersburg MD 20899-8550
> Office:(301) 975-6158
> Fax:(301) 975-4553
>
> --------------------------------------------------------------------------
-----Leadfee Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Leadfree
> To temporarily stop delivery of Leadree for vacation breaks send: SET
Leadfree NOMAIL
> Search previous postings at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
> --------------------------------------------------------------------------
-----
> e-mail:[log in to unmask]
> --=====================_-1870403248==_.ALT
> Content-Type: text/html; charset="us-ascii"
>
> <html>
> <font size=3>Thought you might find this to be useful: There was an
> interesting paper on laminate performance titled "Effects of NEMI
> Sn/Ag/Cu Alloy Assembly REflow on Plated Through Hole Performance"
> by John J. Davignon and Randy Reed (SMTA, June 2000, pp.
> 122-129.) The paper evaluated the "changes in PTH
> performance and laminate material properties for several epoxy-based
> laminate systems" for a peak reflow temperature of 260 degC, and up
> to 5 reflow cycles. <br>
> <br>
> A summary of the paper can be found at:<br>
> <a href="http://www.eetasia.com/ARTICLES/2000OCT/2000OCT01_THA_PM_TA1.PDF"
eudora="autourl">http://www.eetasia.com/ARTICLES/2000OCT/2000OCT01_THA_PM_TA
1.PDF</a><br>
> <br>
> Regards,<br>
> Carol Handwerker<br>
> NIST<br>
> <br>
> At 07:35 AM 08/11/2003 +0100, Bob Willis wrote:<br>
> >There are benefits to the higher Tg but most companies using
> lead-free do<br>
> >not use it yet as the standard Tg for laminates has increase over the
> years<br>
> >anyway. I have been running some trials specifically on standard
> and<br>
> >material with a Tg of 170 but no interesting results from a
> process<br>
> >prospective yet.<br>
> ><br>
> >In the case of maximum temperature the problem is the variability
> that the<br>
> >industry will see in reflow and rework hence the suggested need of
> 260C.<br>
> >This gives process guys like me more tolerance in the process.
> Currently the<br>
> >processes I have been working with can reflow at maximum of 245
> for<br>
> >convection, 230 for VP and 265 for wave. Remember many passives and
> active<br>
> >parts go through the wave in the real world.<br>
> ><br>
> >Rework can be controlled below 250 with the correct preheat. The key
> issue<br>
> >is more attention to profiling boards, since the introduction of
> convection<br>
> >many engineers don't spend the time on profiling?<br>
> ><br>
> >Bob Willis<br>
> >2 Fourth Ave, Chelmsford, Essex, CM1 4HA<br>
> >Tel: 01245 351502<br>
> >Fax: 01245 496123<br>
> >Mobile: 07860 775858<br>
> >Email: [log in to unmask]<br>
> >Web:
> <a href="http://www.leadfreesoldering.com/"
eudora="autourl">www.leadfreesoldering.com</a><br>
> >Web:
> <a href="http://www.bobwillis.co.uk/"
eudora="autourl">www.bobwillis.co.uk</a><br>
> ><br>
> ><br>
> ><br>
> >-----Original Message-----<br>
> >From: Leadfree
> [<a href="mailto:[log in to unmask]"
eudora="autourl">mailto:[log in to unmask]]On</a>
> Behalf Of Reuven<br>
> >ROKAH<br>
> >Sent: 11 August 2003 07:37<br>
> >To: [log in to unmask]<br>
> >Subject: Re: [LF] Component Maximum Reflow Temperature
> Requirement<br>
> ><br>
> ><br>
> >Hi All,<br>
> ><br>
> >When designing a new PWB or making it to be LF comply, what
> requirements<br>
> >are needed for each component or PCB, such as:<br>
> ><br>
> >1. PCB Tg. = 170 deg. C<br>
> >2. Components to be comply with reflow temp. of 250
> deg. C<br>
> ><br>
> >There is any agreed list of requirements?<br>
> ><br>
> >Best Regards<br>
> ><br>
> >ROKAH Reuven<br>
> ><br>
>
>------------------------------------------------------------------------
----<br>
> >---Leadfee Mail List provided as a free service by IPC using LISTSERV
> 1.8d<br>
> >To unsubscribe, send a message to [log in to unmask] with following
> text in<br>
> >the BODY (NOT the subject field): SIGNOFF Leadfree<br>
> >To temporarily stop delivery of Leadree for vacation breaks send:
> SET<br>
> >Leadfree NOMAIL<br>
> >Search previous postings at:
> <a href="http://listserv.ipc.org/archives"
eudora="autourl">http://listserv.ipc.org/archives</a><br>
> >Please visit IPC web site
> <a href="http://www.ipc.org/html/forum.htm"
eudora="autourl">http://www.ipc.org/html/forum.htm</a>
> for additional<br>
> >information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700<br>
> >ext.5315<br>
>
>------------------------------------------------------------------------
----<br>
> >---<br>
> ><br>
>
>------------------------------------------------------------------------
----<br>
> >---Leadfee Mail List provided as a free service by IPC using LISTSERV
1.8d<br>
> >To unsubscribe, send a message to [log in to unmask] with following text
in<br>
> >the BODY (NOT the subject field): SIGNOFF Leadfree<br>
> >To temporarily stop delivery of Leadree for vacation breaks send: SET
<br>
> >Leadfree NOMAIL<br>
> >Search previous postings at: <a
href="http://listserv.ipc.org/archives"
eudora="autourl">http://listserv.ipc.org/archives</a><br>
> >Please visit IPC web site <a href="http://www.ipc.org/html/forum.htm"
eudora="autourl">http://www.ipc.org/html/forum.htm</a> for additional<br>
> >information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700 <br>
> >ext.5315<br>
>
>------------------------------------------------------------------------
-------<br>
> </font><br>
> <div>**************************************</div>
> <div>Carol A. Handwerker</div>
> <div>Chief, Metallurgy Division</div>
> <div>NIST </div>
> <div>100 Bureau Drive Stop 8550</div>
> <div>Gaithersburg MD 20899-8550</div>
> <div>Office:(301) 975-6158</div>
> <div>Fax:(301) 975-4553</div>
> e-mail:[log in to unmask]
> </html>
> --------------------------------------------------------------------------
-----<br>Leadfee Mail List provided as a free service by IPC using LISTSERV
1.8d<br>
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field):<br> SIGNOFF Leadfree<br>
> To temporarily stop delivery of Leadree for vacation breaks send: SET
Leadfree NOMAIL<br>
> Search previous postings at: http://listserv.ipc.org/archives<br>
> Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315<br>
> --------------------------------------------------------------------------
-----<br>
>
> --=====================_-1870403248==_.ALT--
>
> ------------------------------
>
> Date: Mon, 11 Aug 2003 15:29:29 +0100
> From: Bob Willis <[log in to unmask]>
> Subject: Re: Component Maximum Reflow Temperature Requirement
>
> This is a multi-part message in MIME format.
>
> ------=_NextPart_000_0064_01C3601D.5ACE6660
> Content-Type: text/plain;
> charset="iso-8859-1"
> Content-Transfer-Encoding: 7bit
>
> Many thanks Carol,
>
> Did you ever find the video of fillet/pad lifting on plated through hole
> boards referred to in your paper?
>
> A link to our Real Player video clip
> Go to www.bobwillis.co.uk/lead/videos/bw723.rm on gold the best one
>
> or www.bobwillis.co.uk/lead/videos/bw721.rm on silver
>
>
> Bob Willis
> 2 Fourth Ave, Chelmsford, Essex, CM1 4HA
> Tel: 01245 351502
> Fax: 01245 496123
> Mobile: 07860 775858
> Email: [log in to unmask]
> Web: www.leadfreesoldering.com
> Web: www.bobwillis.co.uk
>
>
> -----Original Message-----
> From: Leadfree [mailto:[log in to unmask]]On Behalf Of Carol
> Handwerker
> Sent: 11 August 2003 15:36
> To: [log in to unmask]
> Subject: Re: [LF] Component Maximum Reflow Temperature Requirement
>
>
> Thought you might find this to be useful: There was an interesting paper
> on laminate performance titled "Effects of NEMI Sn/Ag/Cu Alloy Assembly
> REflow on Plated Through Hole Performance" by John J. Davignon and Randy
> Reed (SMTA, June 2000, pp. 122-129.) The paper evaluated the "changes in
> PTH performance and laminate material properties for several epoxy-based
> laminate systems" for a peak reflow temperature of 260 degC, and up to 5
> reflow cycles.
>
> A summary of the paper can be found at:
> http://www.eetasia.com/ARTICLES/2000OCT/2000OCT01_THA_PM_TA1.PDF
>
> Regards,
> Carol Handwerker
> NIST
>
> At 07:35 AM 08/11/2003 +0100, Bob Willis wrote:
> >There are benefits to the higher Tg but most companies using lead-free
do
> >not use it yet as the standard Tg for laminates has increase over the
> years
> >anyway. I have been running some trials specifically on standard and
> >material with a Tg of 170 but no interesting results from a process
> >prospective yet.
> >
> >In the case of maximum temperature the problem is the variability that
> the
> >industry will see in reflow and rework hence the suggested need of
260C.
> >This gives process guys like me more tolerance in the process.
Currently
> the
> >processes I have been working with can reflow at maximum of 245 for
> >convection, 230 for VP and 265 for wave. Remember many passives and
> active
> >parts go through the wave in the real world.
> >
> >Rework can be controlled below 250 with the correct preheat. The key
> issue
> >is more attention to profiling boards, since the introduction of
> convection
> >many engineers don't spend the time on profiling?
> >
> >Bob Willis
> >2 Fourth Ave, Chelmsford, Essex, CM1 4HA
> >Tel: 01245 351502
> >Fax: 01245 496123
> >Mobile: 07860 775858
> >Email: [log in to unmask]
> >Web: www.leadfreesoldering.com
> >Web: www.bobwillis.co.uk
> >
> >
> >
> >-----Original Message-----
> >From: Leadfree [mailto:[log in to unmask]]On Behalf Of Reuven
> >ROKAH
> >Sent: 11 August 2003 07:37
> >To: [log in to unmask]
> >Subject: Re: [LF] Component Maximum Reflow Temperature Requirement
> >
> >
> >Hi All,
> >
> >When designing a new PWB or making it to be LF comply, what
requirements
> >are needed for each component or PCB, such as:
> >
> >1. PCB Tg. = 170 deg. C
> >2. Components to be comply with reflow temp. of 250 deg. C
> >
> >There is any agreed list of requirements?
> >
> >Best Regards
> >
> >ROKAH Reuven
> >
>
>
>---------------------------------------------------------------------------
> -
> >---Leadfee Mail List provided as a free service by IPC using LISTSERV
> 1.8d
> >To unsubscribe, send a message to [log in to unmask] with following text
in
> >the BODY (NOT the subject field): SIGNOFF Leadfree
> >To temporarily stop delivery of Leadree for vacation breaks send: SET
> >Leadfree NOMAIL
> >Search previous postings at: http://listserv.ipc.org/archives
> >Please visit IPC web site http://www.ipc.org/html/forum.htm for
> additional
> >information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700
> >ext.5315
>
>
>---------------------------------------------------------------------------
> -
> >---
> >
>
>
>---------------------------------------------------------------------------
> -
> >---Leadfee Mail List provided as a free service by IPC using LISTSERV
> 1.8d
> >To unsubscribe, send a message to [log in to unmask] with following text
in
> >the BODY (NOT the subject field): SIGNOFF Leadfree
> >To temporarily stop delivery of Leadree for vacation breaks send: SET
> >Leadfree NOMAIL
> >Search previous postings at: http://listserv.ipc.org/archives
> >Please visit IPC web site http://www.ipc.org/html/forum.htm for
> additional
> >information, or contact Keach Sasamori at [log in to unmask] or
847-509-9700
> >ext.5315
>
>
>---------------------------------------------------------------------------
> ----
>
>
> **************************************
> Carol A. Handwerker
> Chief, Metallurgy Division
> NIST
> 100 Bureau Drive Stop 8550
> Gaithersburg MD 20899-8550
> Office:(301) 975-6158
> Fax:(301) 975-4553
>
>
>
e-mail:[log in to unmask] -------------------------------------------
> ------------------------------------
> Leadfee Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text
in
> the BODY (NOT the subject field):
> SIGNOFF Leadfree
> To temporarily stop delivery of Leadree for vacation breaks send: SET
> Leadfree NOMAIL
> Search previous postings at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/html/forum.htm for
additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
> ext.5315
> ------------------------------------------------------------------------
--
> -----
>
> --------------------------------------------------------------------------
-----Leadfee Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Leadfree
> To temporarily stop delivery of Leadree for vacation breaks send: SET
Leadfree NOMAIL
> Search previous postings at: http://listserv.ipc.org/archives
> Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
> --------------------------------------------------------------------------
-----
>
> ------=_NextPart_000_0064_01C3601D.5ACE6660
> Content-Type: text/html;
> charset="iso-8859-1"
> Content-Transfer-Encoding: quoted-printable
>
> <!DOCTYPE HTML PUBLIC "-//W3C//DTD HTML 4.0 Transitional//EN">
> <HTML><HEAD>
> <META http-equiv=3DContent-Type content=3D"text/html; =
> charset=3Diso-8859-1">
> <META content=3D"MSHTML 6.00.2800.1170" name=3DGENERATOR></HEAD>
> <BODY>
> <DIV><SPAN class=3D760572414-11082003><FONT face=3DArial =
> color=3D#0000ff>Many thanks=20
> Carol, </FONT></SPAN></DIV>
> <DIV><SPAN class=3D760572414-11082003><FONT face=3DArial=20
> color=3D#0000ff></FONT></SPAN> </DIV>
> <DIV><SPAN class=3D760572414-11082003><FONT face=3DArial =
> color=3D#0000ff>Did you ever=20
> find the video of fillet/pad lifting on plated through hole boards =
> referred to=20
> in your paper?</FONT></SPAN></DIV>
> <DIV><SPAN class=3D760572414-11082003><FONT face=3DArial=20
> color=3D#0000ff></FONT></SPAN> </DIV>
> <DIV><SPAN class=3D760572414-11082003><FONT face=3DArial =
> color=3D#0000ff>A=20
> link to our Real Player video clip</FONT></SPAN></DIV>
> <DIV><SPAN class=3D760572414-11082003>
> <P><FONT face=3DArial>Go to </FONT><A=20
> href=3D"http://www.bobwillis.co.uk/lead/videos/bw723.rm"><FONT=20
> face=3DArial>www.bobwillis.co.uk/lead/videos/bw723.rm</FONT></A><FONT=20
> face=3DArial><SPAN class=3D760572414-11082003> </SPAN> on gold the =
> best=20
> one</FONT></P>
> <P><FONT face=3DArial>or </FONT><A=20
> href=3D"http://www.bobwillis.co.uk/lead/videos/bw721.rm"><FONT=20
> face=3DArial>www.bobwillis.co.uk/lead/videos/bw721.rm</FONT></A><FONT=20
> face=3DArial><SPAN class=3D760572414-11082003> </SPAN> on=20
> silver</FONT></P></SPAN></DIV>
> <DIV><FONT face=3DArial></FONT> </DIV>
> <P><FONT size=3D2>Bob Willis<BR>2 Fourth Ave, Chelmsford, Essex, CM1 =
> 4HA<BR>Tel:=20
> 01245 351502<BR>Fax: 01245 496123<BR>Mobile: 07860 775858<BR>Email:=20
> [log in to unmask]<BR>Web: www.leadfreesoldering.com<BR>Web:=20
> www.bobwillis.co.uk<BR></FONT></P>
> <BLOCKQUOTE>
> <DIV class=3DOutlookMessageHeader dir=3Dltr align=3Dleft><FONT =
> face=3DTahoma=20
> size=3D2>-----Original Message-----<BR><B>From:</B> Leadfree=20
> [mailto:[log in to unmask]]<B>On Behalf Of </B>Carol=20
> Handwerker<BR><B>Sent:</B> 11 August 2003 15:36<BR><B>To:</B>=20
> [log in to unmask]<BR><B>Subject:</B> Re: [LF] Component =
> Maximum Reflow=20
> Temperature Requirement<BR><BR></FONT></DIV><FONT size=3D3>Thought you =
> might=20
> find this to be useful: There was an interesting paper on laminate =
> performance=20
> titled "Effects of NEMI Sn/Ag/Cu Alloy Assembly REflow on Plated =
> Through Hole=20
> Performance" by John J. Davignon and Randy Reed (SMTA, June 2000, pp.=20
> 122-129.) The paper evaluated the "changes in PTH =
> performance and=20
> laminate material properties for several epoxy-based laminate systems" =
> for a=20
> peak reflow temperature of 260 degC, and up to 5 reflow cycles. =20
> <BR><BR>A summary of the paper can be found at:<BR><A=20
> =
> href=3D"http://www.eetasia.com/ARTICLES/2000OCT/2000OCT01_THA_PM_TA1.PDF"=
> =20
> =
> eudora=3D"autourl">http://www.eetasia.com/ARTICLES/2000OCT/2000OCT01_THA_=
> PM_TA1.PDF</A><BR><BR>Regards,<BR>Carol=20
> Handwerker<BR>NIST<BR><BR>At 07:35 AM 08/11/2003 +0100, Bob Willis=20
> wrote:<BR>>There are benefits to the higher Tg but most companies =
> using=20
> lead-free do<BR>>not use it yet as the standard Tg for laminates =
> has=20
> increase over the years<BR>>anyway. I have been running some trials =
>
> specifically on standard and<BR>>material with a Tg of 170 but no=20
> interesting results from a process<BR>>prospective =
> yet.<BR>><BR>>In=20
> the case of maximum temperature the problem is the variability that=20
> the<BR>>industry will see in reflow and rework hence the suggested =
> need of=20
> 260C.<BR>>This gives process guys like me more tolerance in the =
> process.=20
> Currently the<BR>>processes I have been working with can reflow at =
> maximum=20
> of 245 for<BR>>convection, 230 for VP and 265 for wave. Remember =
> many=20
> passives and active<BR>>parts go through the wave in the real=20
> world.<BR>><BR>>Rework can be controlled below 250 with the =
> correct=20
> preheat. The key issue<BR>>is more attention to profiling boards, =
> since the=20
> introduction of convection<BR>>many engineers don't spend the time =
> on=20
> profiling?<BR>><BR>>Bob Willis<BR>>2 Fourth Ave, Chelmsford, =
> Essex,=20
> CM1 4HA<BR>>Tel: 01245 351502<BR>>Fax: 01245 =
> 496123<BR>>Mobile: 07860=20
> 775858<BR>>Email: [log in to unmask]<BR>>Web: <A=20
> href=3D"http://www.leadfreesoldering.com/"=20
> eudora=3D"autourl">www.leadfreesoldering.com</A><BR>>Web: <A=20
> href=3D"http://www.bobwillis.co.uk/"=20
> =
> eudora=3D"autourl">www.bobwillis.co.uk</A><BR>><BR>><BR>><BR>>=
> ;-----Original=20
> Message-----<BR>>From: Leadfree [<A=20
> href=3D"mailto:[log in to unmask]"=20
> eudora=3D"autourl">mailto:[log in to unmask]]On</A> Behalf Of=20
> Reuven<BR>>ROKAH<BR>>Sent: 11 August 2003 07:37<BR>>To:=20
> [log in to unmask]<BR>>Subject: Re: [LF] Component Maximum =
> Reflow=20
> Temperature Requirement<BR>><BR>><BR>>Hi =
> All,<BR>><BR>>When=20
> designing a new PWB or making it to be LF comply, what =
> requirements<BR>>are=20
> needed for each component or PCB, such =
> as:<BR>><BR>>1. =20
> PCB Tg. =3D 170 deg. C<BR>>2. Components to be =
> comply with=20
> reflow temp. of 250 deg. C<BR>><BR>>There is any agreed list of=20
> requirements?<BR>><BR>>Best Regards<BR>><BR>>ROKAH=20
> =
> Reuven<BR>><BR>>---------------------------------------------------=
> -------------------------<BR>>---Leadfee=20
> Mail List provided as a free service by IPC using LISTSERV =
> 1.8d<BR>>To=20
> unsubscribe, send a message to [log in to unmask] with following text=20
> in<BR>>the BODY (NOT the subject field): SIGNOFF Leadfree<BR>>To =
>
> temporarily stop delivery of Leadree for vacation breaks send:=20
> SET<BR>>Leadfree NOMAIL<BR>>Search previous postings at: <A=20
> href=3D"http://listserv.ipc.org/archives"=20
> eudora=3D"autourl">http://listserv.ipc.org/archives</A><BR>>Please =
> visit IPC=20
> web site <A href=3D"http://www.ipc.org/html/forum.htm"=20
> eudora=3D"autourl">http://www.ipc.org/html/forum.htm</A> for=20
> additional<BR>>information, or contact Keach Sasamori at =
> [log in to unmask] or=20
> =
> 847-509-9700<BR>>ext.5315<BR>>-------------------------------------=
> ---------------------------------------<BR>>---<BR>><BR>>-------=
> ---------------------------------------------------------------------<BR>=
> >---Leadfee=20
> Mail List provided as a free service by IPC using LISTSERV =
> 1.8d<BR>>To=20
> unsubscribe, send a message to [log in to unmask] with following text=20
> in<BR>>the BODY (NOT the subject field): SIGNOFF Leadfree<BR>>To =
>
> temporarily stop delivery of Leadree for vacation breaks send: SET=20
> <BR>>Leadfree NOMAIL<BR>>Search previous postings at: <A=20
> href=3D"http://listserv.ipc.org/archives"=20
> eudora=3D"autourl">http://listserv.ipc.org/archives</A><BR>>Please =
> visit IPC=20
> web site <A href=3D"http://www.ipc.org/html/forum.htm"=20
> eudora=3D"autourl">http://www.ipc.org/html/forum.htm</A> for=20
> additional<BR>>information, or contact Keach Sasamori at =
> [log in to unmask] or=20
> 847-509-9700=20
> =
> <BR>>ext.5315<BR>>-------------------------------------------------=
> ------------------------------<BR></FONT><BR>
> <DIV>**************************************</DIV>
> <DIV>Carol A. Handwerker</DIV>
> <DIV>Chief, Metallurgy Division</DIV>
> <DIV>NIST </DIV>
> <DIV>100 Bureau Drive Stop 8550</DIV>
> <DIV>Gaithersburg MD 20899-8550</DIV>
> <DIV>Office:(301) 975-6158</DIV>
> <DIV>Fax:(301) 975-4553</DIV>e-mail:[log in to unmask]
> =
> -------------------------------------------------------------------------=
> ------<BR>Leadfee=20
> Mail List provided as a free service by IPC using LISTSERV 1.8d<BR>To=20
> unsubscribe, send a message to [log in to unmask] with following text in =
> the=20
> BODY (NOT the subject field):<BR>SIGNOFF Leadfree<BR>To temporarily =
> stop=20
> delivery of Leadree for vacation breaks send: SET Leadfree =
> NOMAIL<BR>Search=20
> previous postings at: http://listserv.ipc.org/archives<BR>Please visit =
> IPC web=20
> site http://www.ipc.org/html/forum.htm for additional information, or =
> contact=20
> Keach Sasamori at [log in to unmask] or 847-509-9700=20
> =
> ext.5315<BR>-------------------------------------------------------------=
> ------------------<BR></BLOCKQUOTE></BODY></HTML>
> --------------------------------------------------------------------------
-----<br>Leadfee Mail List provided as a free service by IPC using LISTSERV
1.8d<br>
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field):<br> SIGNOFF Leadfree<br>
> To temporarily stop delivery of Leadree for vacation breaks send: SET
Leadfree NOMAIL<br>
> Search previous postings at: http://listserv.ipc.org/archives<br>
> Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315<br>
> --------------------------------------------------------------------------
-----<br>
>
> ------=_NextPart_000_0064_01C3601D.5ACE6660--
>
> ------------------------------
>
> End of Leadfree Digest - 9 Aug 2003 to 11 Aug 2003 - Special issue
(#2003-115)
>
****************************************************************************
**
-------------------------------------------------------------------------------Leadfee Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Leadfree
To temporarily stop delivery of Leadree for vacation breaks send: SET Leadfree NOMAIL
Search previous postings at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-------------------------------------------------------------------------------
|
