Subject: | |
From: | |
Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Mon, 11 Aug 2003 15:49:08 +0100 |
Content-Type: | text/plain |
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Following the comment from Peter we used solder levelled boards on the Lead
Free Experience I was running six weeks back in Brighton the process,
equipment, finishes and components we were running at outlined in the story.
http://www.smartgroup.org/ev_leadfree3.asp
It was great fun with 150 engineers all playing with lead-free. We are just
waiting for the sections and push off results before we post the full
results from the test boards run at the Experience.
Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA
Tel: 01245 351502
Fax: 01245 496123
Mobile: 07860 775858
Email: [log in to unmask]
Web: www.leadfreesoldering.com
Web: www.bobwillis.co.uk
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of Peter Lymn
Sent: 11 August 2003 15:45
To: [log in to unmask]
Subject: Re: [LF] PCB finishing type for lead free solution with CSP, BGA &
press-fit connector
Have you considered using lead free Solder as the final finish? Solder
Coating and Hot Air Leveling can provide finishes compatible with the
component types/ assembly techniques your proposing...
-----Original Message-----
From: [log in to unmask] [mailto:[log in to unmask]]
Sent: 11 August 2003 08:56 AM
To: [log in to unmask]
Subject: [LF] PCB finishing type for lead free solution with CSP, BGA &
press-fit connector
Hello,
We have a new project with a very complicated assembly model.
Both side SMT (BGA, CSP, CCGA & QFP .....) , THT ( a lot od dip
component ) and some press-fit connectors.
Who can provide any recommendations for the PCB finishing type ?
Selective imm. Au with OSP ?
Or immersion silver ? Immersion Tin ?
Why ? And why not ?
Irving
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