LEADFREE Archives

August 2003

Leadfree@IPC.ORG

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Subject:
From:
Bob Willis <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Mon, 11 Aug 2003 06:56:51 +0100
Content-Type:
text/plain
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text/plain (89 lines)
A number of people have commented on the active component issues with
lead-free but the original mail did relate to plastics for other mechanical
parts. Don't forget all these parts and others lime:

IDC cables
Wire insulation
Coating and potting on components
Transformer and Inductor coating and impregnations materials
Loose cable insulation
LCD displays
Labels

Bob Willis
2 Fourth Ave, Chelmsford, Essex, CM1 4HA
Tel: 01245 351502
Fax: 01245 496123
Mobile: 07860 775858
Email: [log in to unmask]
Web: www.leadfreesoldering.com
Web: www.bobwillis.co.uk


-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of MA/NY
DDave
Sent: 09 August 2003 19:00
To: [log in to unmask]
Subject: Re: [LF] Component Maximum Reflow Temperature Requirement


Hi

CA-JoeF (of Flex Circuit/Tesera fame) certainly did well with this
addition to this note tread.

Beyond Joe's great note, I hope I was exploring your own Product
Reliability and Field Needs and your Leadership leading manufacturers
and component suppliers meeting your needs; as well as, their process
which is secondary to your product needs.

I like Joe's note.

YiEngr, MA/NY DDave

>You may wish to add to your question:
>
>"To what JEDEC Moisture Sensitivity Level (MSL) will the components be
>certified and to what thermal cycling conditions will the supplier
>guarantee the components to perform with what lead-free solder alloy(s)? "
>
>These answers will highlight the needs for component prep and assembly
>process and rework but they will also help (hopefully) to provide
>engineering with expectations for reliability, management and accounting
>with a sense of the increase cost associated with the new lead-free
>products and a greater sense of liability for the potential cost of
>returns and loss of customer goodwill due to field failures when they
>eventually occur.
>
>This unfortunately does not solve all of the potential for mix-ups but
>it is a start.
>
>The more information we have the better the decisions we should be able
> to make.
>
>Kind regards,
>Joe

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