Hi

CA-JoeF (of Flex Circuit/Tesera fame) certainly did well with this
addition to this note tread.

Beyond Joe's great note, I hope I was exploring your own Product
Reliability and Field Needs and your Leadership leading manufacturers
and component suppliers meeting your needs; as well as, their process
which is secondary to your product needs.

I like Joe's note.

YiEngr, MA/NY DDave

>You may wish to add to your question:
>
>"To what JEDEC Moisture Sensitivity Level (MSL) will the components be
>certified and to what thermal cycling conditions will the supplier
>guarantee the components to perform with what lead-free solder alloy(s)? "
>
>These answers will highlight the needs for component prep and assembly
>process and rework but they will also help (hopefully) to provide
>engineering with expectations for reliability, management and accounting
>with a sense of the increase cost associated with the new lead-free
>products and a greater sense of liability for the potential cost of
>returns and loss of customer goodwill due to field failures when they
>eventually occur.
>
>This unfortunately does not solve all of the potential for mix-ups but
>it is a start.
>
>The more information we have the better the decisions we should be able
> to make.
>
>Kind regards,
>Joe

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