Hi Dave,

The exact question we asked our suppliers was
  "What is your schedule of availability for lead-free products that will
meet the 260 deg. C lead-free manufacturing process."

This temperature profile seemed the most common one we've seem in the
literature.  So we wanted to obtain the status of our vendor in meeting this
requirement.

Doug
------------------------------
Doug Gilbert 
EEDU Component Engineering 
Xerox Corporation M/S ESAE-221
701 S. Aviation Blvd.
El Segundo, CA 90245
Phone (310) 333-7702   Fax (310) 333-6872 
Xerox Intelnet  8 * 823-7702
mailto:[log in to unmask] 


-----Original Message-----
From: No Name [mailto:[log in to unmask]]
Sent: Thursday, August 07, 2003 9:37 PM
To: [log in to unmask]
Subject: Re: [LF] Component Maximum Reflow Temperature Requirement


Hi DougG,

>We are currently surveying our vendors regarding the lead-free initiative
>and have asked for 260 deg. C.  We are glad we may not have to change the
>temperature requirement later.  So far, no vendors have disagreed with 260
>deg. C but the actual responses vary in quality.  I had one small vendor
> ask what the higher temperature requirement was for, after all, their
> parts are lead-free already.  The impact is still spreading.

Maybe it is me, yet I can't quite tell what you are asking your
component suppliers.

"Can your components handle 260C?" is what I am hearing.

If you are asking them to give you a new MSL number or more importantly
HOLD the current MSL number and use 260C as peak temperature in their
testing then your question and the answers here make sense

I don't know your product or your reliability goals or if any of it
is Wave Soldered, Hand Soldered, Fountain Soldered, etc. Please read
the Purpose of J-Std-020B on page 1 to maybe understand why I might
seem confused, or hopefully helpful.


YiEngr, MA/NY DDave

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