LEADFREE Archives

August 2003

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Subject:
Re: Consequence for other components that are affected by the lead-free process
From:
MA/NY DDave <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Thu, 7 Aug 2003 22:46:54 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (30 lines) 
Hi

Tagging onto retiring Erik's note.

During LF introduction for a particular product, the product owner or
their EMS (Electronic Mfg Supplier) should be going out to all their
component suppliers for new part numbers or certification that the
existing components have been tested and have been approved for the
higher process temperatures.

Erik didn't note the JEDEC spec/standard number, yet this will make
it easier for the diligent product owner or EMS house to more easily
specify and weed out components.

My and the concerns of others is that the product owner and probably
many EMS suppliers will not spend the time scrubbing all the components
for the new higher temperatures. Consequently manufacturing and field
problems will result.

YiEngr, MA/NY DDave

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