Hi, Make,
I did some work while working at Ford, and the work is published in the
following paper:
"Application of Lead-Free Eutectic Sn-Ag Solder in No-Clean Thick Film
Electronic Modules. IEEE Transactions on Components, Packaging, and
Manufacturing Technology - Part B, 17(4) (1994), pp. 603-611."
Regards,
Dongkai Shangguan, Ph.D.
Director - Advanced Process Technology
FLEXTRONICS
2090 Fortune Drive, San Jose, CA 95131
Phone: (408) 428 1336 Fax: (408) 576 7988
[log in to unmask]
-----Original Message-----
From: Markus [mailto:[log in to unmask]]
Sent: Thursday, August 07, 2003 12:23 AM
To: [log in to unmask]
Subject: [LF] LF Soldering on Ag/Pt Thick Film
Hi all,
This list has provided me with lots of digested information. However, I
would like to see if anyone has, and is willing to share some knowledge on
issues in applying lead free soldering on thick film hybrids with Ag/Pt
conductors.
-What is the most viable alloy?
-How does the reflow profile differ from that of PCB assembly?
-Reliability concerns: Ag leaching, intermetallic growth...
Any information is highly appreciated!
Regards,
Make
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