All,

During our study of the lead-free electronic assembly process as it relates
to component requirements, the maximum temperature seems varies from 245
deg. C to 260 deg. C.  The IPC/JEDEC J-STD-020B specification says: Peak
temperature for small SMD devices (package volume < 350mm*3) is 250'C Peak
temperature for large SMD devices (package volume > 350mm*3) is 245'C.

Other papers, such as the EMS Forum "Guidelines for Suppliers Transitioning
to Lead-Free Components" and papers from EMS ( Flextronics and Celestica,
for example ) talk about 260 deg. C maximum reflow temperature for
components is required.

Should we ask component manufacturers to qualify their components per JEDEC
standard or 260 deg. C?  Also, wavesolder pot temperature seems to be around
270 deg. C so what maximum temperature do components typically rise to?

Thanks,


Doug
------------------------------
Doug Gilbert
EEDU Component Engineering
Xerox Corporation M/S ESAE-221
701 S. Aviation Blvd.
El Segundo, CA 90245
Phone (310) 333-7702   Fax (310) 333-6872
Xerox Intelnet  8 * 823-7702
mailto:[log in to unmask]

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