I have a question about a problem that's probably going to be a consequence
of a lead-free process.

The consequence of the new alloys is an increase in solder temperature and
preheat temperature, at this time we are using connectors and switches that
are already critical with the temperatures that are used for the SnPb
process because of deformation of the plastic housing. I wasn't able to
find much info about this subject. At this moment I'm afraid that we will
see an increase in after solder parts when we switch to lead-free (and I'm
not too happy with that thought). On the sites of the manufacturers there
is info about the component leads that are lead-free or going to be, but
I'm more concerned with the plastic housing.

I know that we are usually discussing the solder problems that occur with
the lead-free process, but maybe anyone has had any experience with this
topic and can share there results.

With kind regards,


Hilbrand Molema

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