Subject: | |
From: | |
Reply To: | (Leadfree Electronics Assembly Forum) |
Date: | Thu, 7 Aug 2003 02:22:31 -0500 |
Content-Type: | text/plain |
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Hi all,
This list has provided me with lots of digested information. However, I
would like to see if anyone has, and is willing to share some knowledge on
issues in applying lead free soldering on thick film hybrids with Ag/Pt
conductors.
-What is the most viable alloy?
-How does the reflow profile differ from that of PCB assembly?
-Reliability concerns: Ag leaching, intermetallic growth...
Any information is highly appreciated!
Regards,
Make
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