Hi do you mean the volume of solder with respect to the volume paste
printed?
Roughly: For Sn63 Sn62 stencil grade pastes, half [50%] the paste volume is
solder. This is good enough most of the time.
Precisely: you can work it out if you know the density of the alloy, density
of the paste flux vehicle and metal percent of the particular paste you are
using. You convert the relative weights (as advised by paste suppliers,
should be written on the jar) to volumes according to the densities.
Example:
Sn63 paste 90% by weight solder.
Density Sn63 = 8.4
Density flux = 1.0 (you should check with your supplier)
So 100 gram of solder paste is 90 gram of metal and 10 gram of flux.
90 grams of metal is (90 / 8.4 =) 10.70 cc
10 grams of flux is (10 / 1.0 =) 10.00 cc
You can do your own percents!
So if you actually do know what volume you have printed you know how much
solder you have per pad.
Regards
Mike Fenner
Applications Engineer, European Operations
Indium Corporation
T: + 44 1908 580 400
M: + 44 7810 526 317
F: + 44 1908 580 411
E: [log in to unmask]
W: www.indium.com
Pb-free: www.Pb-Free.com
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Yannick
Brisson
Sent: Wednesday, August 06, 2003 6:24 PM
To: [log in to unmask]
Subject: [TN] solder fillet
Hi,
I would like to calculate the solder fillet left on the pad after a
reflow( does it change depending on the component of the pad?), does anyone
know the formula to do that or knows a web site that describ how to do it?
Thank You
Yannick
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