Sender: |
|
X-To: |
|
Date: |
Fri, 22 Aug 2003 11:13:33 -0500 |
Reply-To: |
|
Subject: |
|
MIME-Version: |
1.0 |
Content-Transfer-Encoding: |
quoted-printable |
Content-Type: |
text/plain; charset="iso-8859-1" |
From: |
|
Parts/Attachments: |
|
|
Technetters,
How does your Quality department test components for solderability? Do they still test to the MIL-STD-202, MIL-STD-750D which is a soldering iron or solder pot test? I'm looking to have my company test to IPC/EIA J-STD-002A 4.2.5 "test S- surface mount process simulation test." This test basically is placing solderpaste on ceramic and running it through the reflow oven. My thought is that this is how these components are going to be used, so this test better reproduces the actual world.
But, many component manufactures still use one of the MIL standards. As you all know, components will solder much better using the MIL test then the IPC test.I can see there is gonna be difficulty in getting them to accept them back as defective. How do you handle this? Do you test to the MIL test because thats what the manufacture does? How would you handle the issue of the component passing the MIL test but failing the IPC test Knowing that the IPC test reflects your manufacturing process?
Larry
---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------
|
|
|