David,
It's been a while since I've used hot bar soldering.
There was a requirement to minimize the lead deflection to reduce residual
stress which would pull the lead out of the solder connection during
operation. The limit as I recall was 2T or 2 times the lead thickness.
Other than that the standards required a "documented process, available for
review", and no lead deformation beyond the physical damage limits (as I
recall 10%) where they were contacted by the hot bar.
Pictures - there was a series produced by Martin that had some definition
but the criteria was all based upon similar content for gull wing (assume
that these are gull wing) components regardless of the method of reflow. Not
much different. IPC-A-610 has the solder and lead placement characteristics
also.

Good luck!
Mel

Mel Parrish
Soldering Technology International
Madison, AL

-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of David Harman
Sent: Tuesday, July 01, 2003 10:31 AM
To: [log in to unmask]
Subject: [TN] Hot bar soldering


I am looking for inspection criteria and pictures that I can send out to our
CM for hot bar soldering acceptability. We are familiar with the IPC
soldering requirements for assemblies but wanted to know if there were any
other criteria that maybe better suitable for this process.


Thanks
David

---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to
[log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to
[log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700
ext.5315
-----------------------------------------------------


---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------