Hi Werner True all of the items you mention do effect the potential cracking
of a via , however what I was trying to say was we do not know how close we
are to the potential for a crack if the assembly uses to many high temp
solder type cycles, and we do not realise how easy it is to fix. a little
bit more copper  is strong enough to  overcome  T/G, type of material and
the copositon , size and numer of holes and thickness and other potential
cracking areas.
I realise IPC and people have beat this to death but I also belive we are
never to old to learn . my 2 cents worth.

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