Hi Ahne! Yep, we're on the same page but I just haven't found that "cliff
edge" where one of today's component technologies would push me over. Flip
chip technology came pretty close but we have found that using tacky flux
works quite well and we can avoid solder paste stencil issue altogether.

Dave



                      Ahne Oosterhof
                      <[log in to unmask]        To:       [log in to unmask]
                      >                        cc:
                      Sent by: TechNet         Subject:  Re: [TN] Type 6 solder paste
                      <TechNet@listserv
                      .ipc.org>


                      07/03/2003 12:01
                      PM
                      Please respond to
                      Ahne






Hi Dave,
My experience says that when you have apertures in a stencil that are
smaller than the recommended size for that stencil you are likely to get
insufficients. Under those conditions going to a finer solder paste will
get
you improvements.

Ahne.


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Dave Hillman
Sent: Thursday, July 03, 2003 09:25
To: [log in to unmask]
Subject: Re: [TN] Type 6 solder paste


Hi Bev! We just completed a series of assembly tests for 0201 chip
components - a portion of the DOE matrix included a comparison of Type 3
versus Type 4 solderpaste. Our statistical terrorist determined that the
Type 4 paste did not perform any better than the Type 3 paste. The 0201 pad
pattern is pretty small, I can't imagine an application where you would
need to use a Type 6 paste. Food for thought. What application has got you
thinking of using Type 6 paste (or did you just have too happy of a Canada
Day holiday!)?
Dave Hillman
Rockwell Collins
[log in to unmask]

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