Hi Dave,
My experience says that when you have apertures in a stencil that are
smaller than the recommended size for that stencil you are likely to get
insufficients. Under those conditions going to a finer solder paste will get
you improvements.

Ahne.


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Dave Hillman
Sent: Thursday, July 03, 2003 09:25
To: [log in to unmask]
Subject: Re: [TN] Type 6 solder paste


Hi Bev! We just completed a series of assembly tests for 0201 chip
components - a portion of the DOE matrix included a comparison of Type 3
versus Type 4 solderpaste. Our statistical terrorist determined that the
Type 4 paste did not perform any better than the Type 3 paste. The 0201 pad
pattern is pretty small, I can't imagine an application where you would
need to use a Type 6 paste. Food for thought. What application has got you
thinking of using Type 6 paste (or did you just have too happy of a Canada
Day holiday!)?
Dave Hillman
Rockwell Collins
[log in to unmask]
---------------------------------------------------
TechNetters,
I just did a search of the archives on the above subject from Jan 2000 to
the present and found just the name of one company using the stuff, no
actual info.  Is there anyone out there that can tell me about using this
material - storage procedures, handling, reflow conditions and anything
else I need to know about this type of material?  Yes, I know it is
expensive.
regards,
Bev Christian
Research in Motion
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