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| Date: | Thu, 3 Jul 2003 12:35:55 -0400 |
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http://www.cooksonsemi.com/distributors/pdfs/2002115625.pdf
Bev with ultrafine pitch? Too geeky...
jk
>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of
>Dave Hillman
>Sent: Thursday, July 03, 2003 12:25 PM
>To: [log in to unmask]
>Subject: Re: [TN] Type 6 solder paste
>
>
>Hi Bev! We just completed a series of assembly tests for 0201
>chip components - a portion of the DOE matrix included a
>comparison of Type 3 versus Type 4 solderpaste. Our
>statistical terrorist determined that the Type 4 paste did not
>perform any better than the Type 3 paste. The 0201 pad pattern
>is pretty small, I can't imagine an application where you
>would need to use a Type 6 paste. Food for thought. What
>application has got you thinking of using Type 6 paste (or did
>you just have too happy of a Canada Day holiday!)?
>
>Dave Hillman
>Rockwell Collins
>[log in to unmask]
>
>
>
>
> Bev Christian
> <[log in to unmask] To:
>[log in to unmask]
> ET> cc:
> Sent by: TechNet Subject: [TN]
>Type 6 solder paste
> <TechNet@listserv
> .ipc.org>
>
>
> 07/03/2003 10:41
> AM
> Please respond to
> "TechNet E-Mail
> Forum."; Please
> respond to Bev
> Christian
>
>
>
>
>
>
>TechNetters,
>I just did a search of the archives on the above subject from
>Jan 2000 to the present and found just the name of one company
>using the stuff, no actual info. Is there anyone out there
>that can tell me about using this material - storage
>procedures, handling, reflow conditions and anything else I
>need to know about this type of material? Yes, I know it is
>expensive. regards, Bev Christian Research in Motion
>
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