Technet,

We have been using IPA to clean SMT adhesive off the stencil during the
build and ultrasonic wash after the build. Over time we started noticing
residues of adhesive around the inside walls of the stencil appertures. The
adhesive appeared to be cured and hardened and we tried many ways but were
unsuccessful in removing it (brush with more aggressive solvent, ultrasonic
clean etc.)

We were informed that a specific proprietary cleaner solvent has to be used
to clean the adhesive off the stencil effectively. The down side is a 5X
cost compared to IPA and a 2-5 times slower evaporation rate.

Does anyone have similar experience with cleaning SMT adhesive off the
stencil? What is the common cleaning interval applied during adhesive
printing? (we clean every 5 prints) Any suggestion in methods to
recondition the stencil appertures?


Rgds,
Peter

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