For goodness sake! Can we PLEASE have less html and more subject titles?

Thanks.

Brian

Walters, Karen wrote:
>
>
>         Can anyone reference for me the the IPC SPEC that states what
>         the pad surface area requirement is to the weight of the
>         packaged device.  We may be having an issue with a floating
>         component during reflow.  Please also provide the ratio if
>         anyone knows it off hand.
>
>         thanks
>
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