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Subject:	Making the Leap to Lead Free
From:	Jack Crawford <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 29 Jul 2003 15:49:20 -0500
Content-Type:	text/plain
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Making the Leap to Lead Free

August 19-20, 2003 ♦ Longmont, CO



How do you develop your company’s lead free plan and where do you start? What’s currently happening in the U.S. and are you ahead of the curve or behind it? How do these lead free issues concern you and the future of your company? On August 19, get educated on specific lead free solder issues by attending either one or both half day workshops (W) or the full-day (T) tutorial. IPC and Maxtor Colorado Corporation have the answers to the lead free quandary.



•T-01: Electronics Manufacturing with Lead Free, Halogen Free, and Conductive Adhesive

John Lau, Ph.D., Agilent Technologies

•W-01: Lead Free Interconnections, Technology, Application and Selections

Jennie Hwang, Ph.D., H-Technologies Group

•W-02: Lead Free PCB Surface Finishes and Component Coating

Jennie Hwang, Ph.D., H-Technologies Group



Let us help you make your lead free decision today! The one-day conference on August 20, 2003 has been developed so you can hear from OEMs, suppliers and board manufacturers who have already faced the challenges of lead free.



REGISTER NOW and keep your company at the forefront of lead free technology.



For registration information, visit our website at www.ipc.org/LFLongmont.

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