Bill,

Be careful!  Don't try to save money know matter how much it costs!!

David A. Douthit
Manager
LoCan LLC

"Kasprzak, Bill (sys) USX" wrote:

> Hello all,
>
> Is there any data or study that I can use that shows what the internal
> junction temperature of a leaded device is when removing a part with a
> solder sucking operation. Is there any reason why an IC, diode, or cap
> cannot be re-used when removed from a circuit board prior to test if the
> device was installed with incorrect polarity? I think that the PWB serves as
> a buffer when desoldering from the solder side and therefore the part is
> protected.
>
> We are in the launch vehicle business. There are some that say a part can
> only be soldered once. So, a diode soldered into a board cannot be removed
> and re-soldered correctly even though no power has been applied. The
> unsoldered part must be discarded and replaced with a new part.
>
> Any ideas how this relates to surface mount?
>
> I know that part re-use takes place all the time but the fact that launch
> vehicles are involved fosters a very conservative approach. Any comments
> from the high-rel, class 3 folks?
>
> Thanks to all who can respond, I really appreciate it.
>
> Bill Kasprzak
> Moog Inc, Electronics Process Engineering
>
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