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July 2003

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Subject:
From:
"Kasprzak, Bill (sys) USX" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 29 Jul 2003 11:47:00 -0400
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Frank,

Before I can answer, does normal touchup fix these joints quickly using an
RMA flux? Or is there considerable effort to get these pads to flow?


Bill Kasprzak
Moog Inc, Electronics Process Engineering


-----Original Message-----
From: Frank L Norman [mailto:[log in to unmask]]
Sent: Tuesday, July 29, 2003 10:37 AM
To: [log in to unmask]
Subject: [TN] PICTURES: Wave solder process gone bad


Technet,

PWA's experienced solder wetting difficulties to plated through holes
including via's during the wave solder process. PWA's are two sided
multilayer finished with Electroless Nickel Immersion Gold (ENIG). Top
side SMT components were reflowed and bottom side SMT and through hole
components were wave soldered.

SEE PICTURES of bottom side of PWA at this website.

http://www.ripus.com/images/pwa/index.htm

Does anyone know what may have caused this issue?

Regards,
Frank Norman
Manufacturing Support Engineer
Raytheon, Space and Airborne Systems (SAS)
(805)879-2745
[log in to unmask]

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