Hello all,

Is there any data or study that I can use that shows what the internal
junction temperature of a leaded device is when removing a part with a
solder sucking operation. Is there any reason why an IC, diode, or cap
cannot be re-used when removed from a circuit board prior to test if the
device was installed with incorrect polarity? I think that the PWB serves as
a buffer when desoldering from the solder side and therefore the part is
protected.

We are in the launch vehicle business. There are some that say a part can
only be soldered once. So, a diode soldered into a board cannot be removed
and re-soldered correctly even though no power has been applied. The
unsoldered part must be discarded and replaced with a new part.

Any ideas how this relates to surface mount?

I know that part re-use takes place all the time but the fact that launch
vehicles are involved fosters a very conservative approach. Any comments
from the high-rel, class 3 folks?

Thanks to all who can respond, I really appreciate it.

Bill Kasprzak
Moog Inc, Electronics Process Engineering

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