Hi Douglas,

I never profile in "wet" paste.
For "high rel" electronics we also have to scrap a board, using almost the
same method as you do.
But for standard applications I only have to scrap a new bare board.
I use old scrapped components to populate the board, creating the same
circumstances as with the real board.

But the thermocouples are never placed in wet paste.
What is the benefit of doing that?
Is the profile that different if I attach the thermocouple on a solid
solderjoint?



Jowan Iven



-----Original Message-----
From:   TechNet [mailto:[log in to unmask]] On Behalf Of McCall,Doug
Sent:   dinsdag 29 juli 2003 9:34
To:     [log in to unmask]
Subject:        [TN] Attaching mole thermocouples to PCBA's being profiled at
reflow

Hi all,

When profiling a PCB assembly through a reflow oven process
how do you guys actually attach the thermocouples.  The reason
for asking this question is that if you attempt to put the wires
(x6) over the wet solder paste then the components & devices will
be moved by the loose thermocouple wires.

Therefore, I have been using a scrap PCB assembly and profiling a
number of times, but this means having a scrap one out of the batch.

Any thoughts appreciated.

Thanks,

Douglas I McCall,
PCB Manufacturing Engineer

BOC EDWARDS,
Marshall Road,
Eastbourne,
East Sussex,
BN22 9BA UK
Tel: +44 (0) 1323 501 147
Fax: +44 (0) 1323 509 824
mailto:[log in to unmask]


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