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July 2003

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Subject:
Re: Wave solder process issue on ENIG pwa
From:
"Wenger, George M." <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 28 Jul 2003 14:37:59 -0400
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Frank,

 

Did you do any characterization of the boards before assembly?  Do you know what the immersion gold thickness was on the ENIG boards?  Did you do solderability testing before or after stressing the boards?  Do you have any boards left that you could use to characterize the surface finish on the boards?



	-----Original Message----- 

	From: Frank L Norman [mailto:[log in to unmask]] 

	Sent: Mon 7/28/2003 1:26 PM 

	To: [log in to unmask] 

	Cc: 

	Subject: [TN] Wave solder process issue on ENIG pwa

	

	

	 

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