Is there a specification for the % phosphorous in the nickel deposit for
electroless
Nickel/Immersion Gold for surface mount pads on PWBs?  We are seeing as
high as 14% and are also seeing solder joint failures at the nickel
interface on
BGAs w/18mil balls.  Is there an industry standard for phosphorous content?
If there is no industry standard, any ideas of what the spec should be?
Thank you.

Best Regards,

Mike Forrester
LeCroy Corp.

---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------