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July 2003

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Subject:
Re: FW: [TN] Solder fillets
From:
Bev Christian <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 24 Jul 2003 17:19:02 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (105 lines) 
Paul,
Its been done (probably theoretically by FEA) but I can't remember who or when.  What I DO remember is it was:
toe 5%
lead proper 20%
heel 75%

regards,
Bev Christian

-----Original Message-----
From: Dehoyos, Ramon [mailto:[log in to unmask]]
Sent: July 24, 2003 8:25 AM
To: [log in to unmask]
Subject: [TN] FW: [TN] Solder fillets


>       Paul:
>       By logical thinking without any experimentation the heel is the one
> that provides the most adhesion of the lead to the board.
>       Regards,
>       Ramon
>
> -----Original Message-----
> From: Stolar, Paul W [SMTP:[log in to unmask]]
> Sent: Tuesday, July 22, 2003 5:57 PM
> To:   [log in to unmask]
> Subject:      [TN] Solder fillets
>
> Has anyone done experimentation to determine which part of the fillet adds
> the most strength?
>
>             Toe
>
>             Heel
>
>             Side fillet
>
>             Under the lead (foot fillet?)
>
>
>
> Paul Stolar
>
> Materials Engineer
>
> Houston Technology Center
>
> Baker Atlas
>
> 713-625-5376
>
> 713-625-4949 (fax)
>
>
>
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