I did use UV curable epoxy for prototype....(it will be part of
assembly.. Not removable).

jk

>-----Original Message-----
>From: TechNet [mailto:[log in to unmask]] On Behalf Of Carlr Ray
>Sent: Tuesday, July 22, 2003 3:30 PM
>To: [log in to unmask]
>Subject: Re: [TN] Collapsing BGA
>
>
>Hey Doug,
> I have seen people use Kapton tape on the four corners of the
>device as type of mechanical stop or visual indicator of ball
>collapse. We would use 1 mil thick Kapton and make a grid from
>4 mil to 10 mil thick stack ups. We would then cut smaller
>grids out of each section and place the smaller pieces in the
>4 corners of the BGA. Depending on the size of the ball and
>package we would determine the preferred amount of collapse
>and use the appropriate tape thickness from the grid.  I wish
>I could say we developed this method but a local company (STI)
>trained some of our operators to perform BGA rework and used
>this method. We have had very good success with it.
>
>>>> [log in to unmask] 07/22/03 01:42PM >>>
>BGA collapsing we also have 3 Air Vac DRS24. I was reading the
>article dated on 22JULY in regards to placing  non-solderable
>material under the corners of the BGA. My question is what
>kind of material is being used?
>
>
>
>        NOKIA Connecting People
>         Douglas L, Trimble
>      Training Instructor: Rework / uBGA
>      After Market Services Training Americas Region
>      Nokia, Inc.
>      795 W. Nasa Blvd., Melbourne, FL 32901
>      Office: (321) 726-4545
>      Email: [log in to unmask]
>
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