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July 2003

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 2 Jul 2003 10:24:20 -0400
Content-Type:
text/plain
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text/plain (118 lines)
I wonder if the ramp to reflow would be too fast for some the the
packages we use today. Some BGA packages will warp if ramp rates exceed
1?C per second.

> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]] On Behalf Of
> Jason W. Gregory
> Sent: Wednesday, July 02, 2003 9:26 AM
> To: [log in to unmask]
> Subject: Re: [TN] Double-sided reflow with Altera RQFP...
>
>
> Bill,
>
> I encountered vapor phase in a former life and although I
> have never used step soldering, found vapor phase to be
> unequalled in thermal distribution. The only downside is cost
> of media (fluid) and some on this forum have spoken of
> possible health and ozone concerns in regards to fluorinated
> fluids. We used Galden and 3M fluid and it wasn't cheap.
> Results were excellent.
>
>
>
> Jason Gregory
> SMT Production Supervisor/
> Integrated Product Team Leader
> LaBarge Inc.
> (918)459-2367
> (918)459-2221 fax
> [log in to unmask]
> http://www.labarge.com
>
>
>
>                       [log in to unmask]
>                       Sent by: TechNet         To:
> [log in to unmask]
>                       <TechNet@listserv        cc:
>                       .ipc.org>                Subject:  Re:
> [TN] Double-sided reflow with Altera RQFP...
>
>
>                       07/02/2003 07:19
>                       AM
>                       Please respond to
>                       "TechNet E-Mail
>                       Forum."; Please
>                       respond to
>                       Wgkenyon2
>
>
>
>
>
>
> A historical note: What ever happened to step soldering using
> different vapor phase fluids of precise boiling points? As I
> recall there was a paper on this by NT (?) about such a
> process run very successfully at their West Palm Beach
> facility at one of the NEPCON technical proceedings some
> years ago. Proper selection of the alloys used and the
> K-Fluids (which boiled about 30 degrees apart, as I recall)
> allowed this step soldering to be done with ease. In some
> cases, mixed K-Fluids were used to 'tailor' the vapor phase
> to the alloys in use. The entire range went from K-6 (typical
> for eutectic
> tin-lead) up
> to K-10, which could melt pure tin.
>
> Bill Kenyon
> Global Centre Consulting
> P.O. Box 553, Montchanin, DE 19710 USA
> Tel: 302.652.4272     Fax: 302.652.5701   Cell: 302.377.4272
> email: [log in to unmask]
>
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