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July 2003

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Subject:
From:
Reuven ROKAH <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 18 Jul 2003 20:12:43 +0300
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text/plain (126 lines)
Thanks Bev,

I  agree that there is a correlation between the pull test to reliability
of solder joints.

I think that it cheap, fast and give first indication on the solder joint
quality (in addition to the visual inspection).

May be we have to adopt the process/ logic of the pull test done to check
the adhesion of pads to the epoxy glass on PCBs.

Best  Regards

ROKAH Reuven
Chief Engineer
ECI Telecom LTD.
Operations Division
30 Hasivim St. Petah-Tikva 49517
                 ISRAEL
Tel: 972-3-9266734    Mobile:972-55-786734
Fax: 972-3-9266480
e mail: [log in to unmask]



                      Bev Christian
                      <[log in to unmask]         To:      [log in to unmask]
                      NET>                     cc:
                      Sent by: TechNet         Subject: Re: [TN] Pull test for SMT components
                      <TechNet@LISTSER
                      V.IPC.ORG>


                      17/07/2003 19:27
                      Please respond
                      to "TechNet
                      E-Mail Forum.";
                      Please respond
                      to Bev Christian





Rokah,
There are no open standards for this test.  Also, Werner Engelmaier and
others will tell you that shear/pull testing has no place in reliability
testing.  However, it certainly can tell you if you are going to have any
infants (cold joints, Black Pad, insufficients).  The British NPL also has
some interesting data that suggests that pull/shear testing and long term
reliability are not completely divorced from each other, but a lot more
work needs to be done.

regards,
Bev Christian
Research in Motion

-----Original Message-----
From: Reuven ROKAH [mailto:[log in to unmask]]
Sent: July 17, 2003 9:50 AM
To: [log in to unmask]
Subject: [TN] Pull test for SMT components


Hi Technetters,

Pls inform if you know any std. or research on solder joints pull test for
SMT components per shape type (0805, 1206, gull wing, plcc using force
gauge (table with minimal force for each component).

I think it should be per area (mm square ) of the connection between the
PCB to the component termination.

e.g.  I am not askeing about HASS od HALT tests.

Best  Regards

ROKAH Reuven
Chief Engineer
ECI Telecom LTD.
Operations Division
30 Hasivim St. Petah-Tikva 49517
                 ISRAEL
Tel: 972-3-9266734    Mobile:972-55-786734
Fax: 972-3-9266480
e mail: [log in to unmask]

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