Dear Sir,

We bought one copy of IPC-A-610C, January 2,000 supersedes rev:B, Dec .1994.
I have got one simple question, but need your clarification to see if my
understanding is correct?

In section 6.5.2 Exposed basis metal, Figure 6-41 shows a not 100% wetted
pad on PCB land area, it only about 50% in my point of view.

Does this mean that the exposed base metal in unsoldered areas should be
considered normal as shown in the photo of Figure 6-41, just because it is
OPS coated PWB. If so, would you also tell me why?

I would appreciate it if you could answer me ASAP.

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