TECHNET Archives

July 2003

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
Pull test for SMT components
From:
Reuven ROKAH <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 17 Jul 2003 16:50:23 +0300
Content-Type:
text/plain
Parts/Attachments:
text/plain (34 lines) 
Hi Technetters,

Pls inform if you know any std. or research on solder joints pull test for
SMT components per shape type (0805, 1206, gull wing, plcc using force
gauge (table with minimal force for each component).

I think it should be per area (mm square ) of the connection between the
PCB to the component termination.

e.g.  I am not askeing about HASS od HALT tests.

Best  Regards

ROKAH Reuven
Chief Engineer
ECI Telecom LTD.
Operations Division
30 Hasivim St. Petah-Tikva 49517
                 ISRAEL
Tel: 972-3-9266734    Mobile:972-55-786734
Fax: 972-3-9266480
e mail: [log in to unmask]

---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/html/forum.htm for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------

ATOM RSS1 RSS2