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July 2003

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Subject:
From:
Charles Caswell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 15 Jul 2003 12:11:43 -0500
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I couldn't find our copy of 7721 but I have done this mod. several times. We did not add a pad. So long as the part is bonded I see no real benifit to adding one other than you could then attach the wire there instead of the part which some people may want for aesthetics. The last time I added a pad for a mod. I also added traces.
Charles Caswell

-----Original Message-----
From: [log in to unmask]
[mailto:[log in to unmask]]
Sent: Tuesday, July 15, 2003 10:30 AM
To: [log in to unmask]
Subject: [TN] Surface mount diode-no pad one end


    I have an engineering modification proposal which has a surface mount diode
shifted so that only one end is on an original solder pad. The other end will
have a wire soldered to the terminal which has no PWB solder pad. The component
body will be bonded to the board.

    It has been past practice in this Class 3 and MIL-STD house to add a pad for
the modification but that is coming under question now. My research has not
turned up a requirement or a guideline to show that a pad is required. IPC R-700
and 7721 do not address this situation. Does anyone know of a paragraph to
provide guidance?

Thanks,

Stu Korringa
Smiths Aerospace
Grand Rapids, Michigan
[log in to unmask]
616.241.8189


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