Hello Stu,
Look at IPC-7721 Method 6.3 (effective per Change 2 to IPC-7721 dated April
2001 and available for download at www.ipc.org).  The answer to your
question lies into the ability of that configuration to survive under the
product end use environment.  One other question to ponder is:  what is a
more reliable and compliant bond, an adhesive bond between component and
substrate or the adhesive bond between the added pad and substrate that is
subsequently soldered to?

Steve Sauer
Sr. Manufacturing Engineer
Northrop Grumman, Electronic Systems
Xetron
Cincinnati, OH

-----Original Message-----
From: [log in to unmask]
    I have an engineering modification proposal which has a surface mount
diode
shifted so that only one end is on an original solder pad. The other end
will
have a wire soldered to the terminal which has no PWB solder pad. The
component
body will be bonded to the board.

    It has been past practice in this Class 3 and MIL-STD house to add a pad
for
the modification but that is coming under question now. My research has not
turned up a requirement or a guideline to show that a pad is required. IPC
R-700
and 7721 do not address this situation. Does anyone know of a paragraph to
provide guidance?

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