I have an engineering modification proposal which has a surface mount diode
shifted so that only one end is on an original solder pad. The other end will
have a wire soldered to the terminal which has no PWB solder pad. The component
body will be bonded to the board.

    It has been past practice in this Class 3 and MIL-STD house to add a pad for
the modification but that is coming under question now. My research has not
turned up a requirement or a guideline to show that a pad is required. IPC R-700
and 7721 do not address this situation. Does anyone know of a paragraph to
provide guidance?

Thanks,

Stu Korringa
Smiths Aerospace
Grand Rapids, Michigan
[log in to unmask]
616.241.8189


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