Looking for 1 mil minimum.  How would it compare to Tensile and elongation
of electrolytic?  Is the chemistry proprietary or is it marketed by all?
Does one fare better then others with regard to physical properties?

Jim Marsico
Senior Engineer
Production Engineering
EDO Electronics Systems Group
[log in to unmask] <mailto:[log in to unmask]>
631-595-5879


        -----Original Message-----
        From:   Rudy Sedlak [SMTP:[log in to unmask]]
        Sent:   Monday, July 14, 2003 11:36 AM
        To:     [log in to unmask]
        Subject:        Re: [TN] high build electroless

        How thick you planning to go?  1.3 mils is pretty standard when
building full additive boards, and if you have the time...it goes pretty
well...results function well, compared to electrolytic Copper.

        Rudy Sedlak
        RD Chemical Company
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