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July 2003

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Subject:
Re: Design guidelines CSP
From:
Dave Chapman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 1 Jul 2003 18:03:39 -0500
Content-Type:
text/plain
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text/plain (59 lines) 
From a stencil perspective we change .012 opening to .014 square with
rounded corners.

.014 to .016
.016 to .018
.018 leave at .018
.024 reduce to .020
.030 reduce to .026

Dave Chapman
Manufacturing Engineer
Circuit Service Inc.


-----Original Message-----
From: Zweigart, Siegmund [mailto:[log in to unmask]]
Sent: Tuesday, July 01, 2003 2:26 AM
To: [log in to unmask]
Subject: [TN] Design guidelines CSP


Hello All

What are your recommendations regarding land pattern design for a Fine-
Pitch Ball grid Array (FBGA) 12*11 mm
0.8 mm (31,8 mil) pitch, 0.3 mm (12mil) ball diameter.
We use at the moment a 12 mil land pattern and 12 mil stencil opening (6
mill thick).
My main concerns are because of voiding in the solder joint.

Any comments welcome

Siggi

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