LEADFREE Archives

July 2003

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Subject:
Accelerated Thermal Cycle Profile
From:
Tarun Gupta <[log in to unmask]>
Reply To:
(Leadfree Electronics Assembly Forum)
Date:
Wed, 30 Jul 2003 09:21:23 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (20 lines) 
We are performing an accelerated thermal cycle test for Solder Joint
Reliability of Lead Free Alloy for a -40C to 85C automotive application.
We are using a slow thermal cycling chamber that takes a long time fall
time (60 Min) from 85C to -40C.  In order to speed up our thermal cycle,
does anyone know the minimum requirements for soak(dwell) time at
temperature extremes and rise/fall time that can give us an acceptable
reliability data.

Regards,
Tarun Gupta

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