Subject: | |
From: | |
Reply To: | (Designers Council Forum) |
Date: | Tue, 1 Jul 2003 09:25:59 +0200 |
Content-Type: | text/plain |
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Hello All
What are your recommendations regarding land pattern design for a Fine-
Pitch Ball grid Array (FBGA) 12*11 mm
0.8 mm (31,8 mil) pitch, 0.3 mm (12mil) ball diameter.
We use at the moment a 12 mil land pattern and 12 mil stencil opening (6
mill thick).
My main concerns are because of voiding in the solder joint.
Any comments welcome
Siggi
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