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Subject:	Re: [BULK] - [DC] BGA / mikro BGA / CSP land patterns
From:	Denis Lefebvre <[log in to unmask]>
Reply To:	(Designers Council Forum)
Date:	Wed, 30 Jul 2003 07:38:15 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (37 lines)

Intel has some good app notes on BGA's. Sorry, I don't have a link for you but I am sure you can find them with some diligent searching.

-----Original Message-----
From: Zweigart, Siegmund [mailto:[log in to unmask]]
Sent: Wednesday, July 30, 2003 7:31 AM
To: [log in to unmask]
Subject: [BULK] - [DC] BGA / mikro BGA / CSP land patterns


Hello all

Which pad size do you use for BGA / CSP designs?
Do you use a special factor (e.g. 0,85) between Ball size and land?
Do you know of any reliability studies covering this topic?

Siggi

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