Subject: | |
From: | |
Reply To: | (Designers Council Forum) |
Date: | Sat, 26 Jul 2003 08:55:47 -0400 |
Content-Type: | text/plain |
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Peel strength of the PCB material is a major concern when soldering wires
to SMT pads.
For static boards using 26-30 gauge wire on FR4, I typically use a 0.040
x 0.080" pad and
occasionally use a 0.030 x 0.060" as a minimum size in dense areas.
Smaller size pads tend to lift during high temperature soldering or rough
handling.
Raymond Smith
Sr. PCB Design
Elcom Technologies
11 Volvo Drive
Rockleigh, NJ.
[log in to unmask]
On Fri, 25 Jul 2003 15:48:26 -0400 "Maisch, John" <[log in to unmask]>
writes:
> We need to hand-solder 26AWG & 30AWG wires, to individual lands on
> the
> surface of our PWB, as part of the production assembly; not "rework"
> wires.
>
> Does anyone know of any formulas or guidelines, for calculating the
> minimum
> land size required, for this type of termination?
>
> Thanks for your help,
>
> John Maisch jr
> PWB Design Group Leader
>
> Formation, Inc.
> 121 Whittendale Dr.
> Suite A
> Moorestown, NJ 08057-1365
> tel: 856 234-5020 x2390
> fax: 856 234-5242
> email: [log in to unmask] <mailto:[log in to unmask]>
>
>
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