don't you mean "could"???


----- Original Message -----
From: "Macko, Joe @ IEC" <[log in to unmask]>
To: <[log in to unmask]>
Sent: Wednesday, July 02, 2003 11:05 AM
Subject: Re: [TN] BGA Viods


> Carl,
>
> Blind vias in the pads would contribute to any voiding.
>
> joe
>
> -----Original Message-----
> From: Carlr Ray [mailto:[log in to unmask]]
> Sent: Wednesday, July 02, 2003 8:19 AM
> To: [log in to unmask]
> Subject: [TN] BGA Viods
>
>
> Hello All,
>   I have a question (more like a poll I guess), concerning voiding of
> BGA devices.
>   I have PBGA 480 IO paremeter grid device and I am seeing lots of
> voiding. Per the x-ray I am well within the IPC spec of 35% but I am
> still having failures at ICT (OPENS). Once I reviewed the profile I
> noticed we were not hitting the dewell time for flux activiation
> recommended by the solder paste vender (min 60 seconds) and we were
> seeing an extended time above 183c. We have changed the profile but some
> of my companions feel that the size of the pad and amount of solder
> paste is effecting the voiding. I disagree with them and feel that not
> activiating the fluxes and extended time above liquidous is a major
> contibutor to the voids.
>   So now my question, what impact does the pads have with the voiding
> of the spheres on the BGA?
>
> Carl Ray
> Sr. Manufacturing Engineer
> Huntsville, AL 35807
> Phone: 256-882-4800 ext. 8845
> Cell: 256-990-1990
>
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