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Reply To: | TechNet E-Mail Forum. |
Date: | Tue, 22 Jul 2003 14:30:22 -0500 |
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Hey Doug,
I have seen people use Kapton tape on the four corners of the device
as type of mechanical stop or visual indicator of ball collapse. We
would use 1 mil thick Kapton and make a grid from 4 mil to 10 mil thick
stack ups. We would then cut smaller grids out of each section and place
the smaller pieces in the 4 corners of the BGA. Depending on the size of
the ball and package we would determine the preferred amount of collapse
and use the appropriate tape thickness from the grid.
I wish I could say we developed this method but a local company (STI)
trained some of our operators to perform BGA rework and used this
method. We have had very good success with it.
>>> [log in to unmask] 07/22/03 01:42PM >>>
BGA collapsing we also have 3 Air Vac DRS24. I was reading the article
dated on 22JULY in regards to placing non-solderable material under the
corners of the BGA. My question is what kind of material is being used?
NOKIA Connecting People
Douglas L, Trimble
Training Instructor: Rework / uBGA
After Market Services Training Americas Region
Nokia, Inc.
795 W. Nasa Blvd., Melbourne, FL 32901
Office: (321) 726-4545
Email: [log in to unmask]
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